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Here is a professional English translation of the provided case background and introduction:
One of our recent FPGA projects, delivered in collaboration with a platform laboratory, involves embedded development of FPGA software at the bottom layer, hardware development board selection, and development of image filtering algorithms.
Leveraging the client’s experience and familiarity with validation standards in the application scenario, Younichuang Technology has precisely replicated the product tailored to the customer’s scene requirements. The reason for selecting this project for introduction is its comprehensive development content within our company’s FPGA development sector.
The embedded bottom-layer module mainly consists of several parts including interface communication, signal input and output, drivers, system-on-chip, network ports, and upgrades. The project utilizes dual DSP TMS320C6713BGDPA200+FPGA EP2S30F672I4N chips for image processing; a second EP2S30F672I4N chip is used for sensor data processing. DVI signals are input using the TFP401AMPZPEP, with DS16EV5110ASQE for conditioning the DVI signals.
Please note that some of the technical terms and model numbers are specific to the industry and have been retained in their original form as they are likely to be product or component identifiers.
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